Ni Tao is IE’s columnist, giving exclusive insight into China’s technology and engineering ecosystem. His monthly Inside China column explores the issues that shape discussions and understanding about Chinese innovation, providing fresh perspectives not found elsewhere.
China’s chip industry has been jolted bytwo major funding dealsin recent weeks, putting 3D computing-in-memory (3D CIM) in the spotlight as startups race to tackle AI’s growing data bottleneck.
Ni Tao is IE’s columnist, giving exclusive insight into China’s technology and engineering ecosystem. His monthly Inside China column explores the issues that shape discussions and understanding about Chinese innovation, providing fresh perspectives not found elsewhere.
China’s chip industry has been jolted bytwo major funding dealsin recent weeks, putting 3D computing-in-memory (3D CIM) in the spotlight as startups race to tackle AI’s growing data bottleneck.
